• 3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets
  • 3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets
  • 3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets
  • 3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets

3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets

Application: Industrial
Formula: Nickel-Copper
Classification: Alloy Traget
Grade Standard: Industrial Grade
Certification: ISO
Shape: Rotary,Flat,Round
Gold Member Since 2023

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Guangdong, China
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Basic Info.

Model NO.
CYT-NiCu
Transport Package
Wooden Box
Specification
Customized Size
Trademark
CANYUAN
Origin
China
Production Capacity
1000PCS

Product Description

3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets
PRODUCT DESCRIPTION

The nickel-copper rotating target is obtained by vacuum melting process to produce alloy ingots, and then the ingots are subjected to plastic forming through molding process, with the size customized according to customer requirements.

Technical parameters

Purity: 99.9%;  Ni-20Cu wt%, Ni-30Cu wt%, Ni-56Cu wt%, Ni-70Cu wt%, Ni-80Cu wt%.

Application areas: semiconductor integrated circuits (VLSI), optical discs, flat panel displays, and surface coatings for workpieces.
We can make flat  and rotary sputtering targets.
Specification and purity can be customized.
The description and composition analysis table of 3N high-purity 
nickel-chromium as below:
 Targets Specification
Application PVD sputtering materials
Material nickel-copper
Purity 3N~5N
Size customized
Thickness customized
Shape Rotary sputtering Target, Ring type, sheet type, Plat type and Tube type
Density -g/cm3
Melting Point -ºC
Produce method HIP
3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets

Our Advantage
3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets
3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets


Operation Process
3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets
3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets

Packing Picture
3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets
3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets
3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets


Application:
3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets
3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets
3n, 80/20 Ni Wt%, 60/40 Ni Wt% Nickel-Copper Rotating Targets/Flat Targets

Relating Product
Material Purity
(N)
Components
(wt%)
Density Melting
 Point
Thermal
Conductivity
(Wm-1K-1)
Coefficient of
 expansion
(10-6k-1)
Production
 Process
Al-Alloy 5N - 2.7 660 235 23.1 Smelting
Cr 3N5 - 7.22 1907 94 4.9 HIP
Cu 4N - 8.9 1084 400 16.5 Smelting
Mo-alloy 3N5 - 10.28 2623 139 4.8 HIP
Nb 4N - 8.6 2477 54 7.3 Smelting
Ta 4N - 16.7 3017 57 6.3 Smelting
Si 4N - 2.33 1414 150 2.6 Sintering&Spray
TI 5N - 4.5 1670 22 8.6 Smelting
W 4N - 19.25 3422 174 4.5 HIP
AZO 3N5 98:2 5.6 1975 22 1.5 Sintering
ITO 4N 90:10 7.15 2000 15 2.0 Sintering
GZO 3N5 AS REQUESTED 7.15 - - - Sintering
IGZO 4N AS REQUESTED - - - - Sintering
NbOx 4N - 4.6 1460 5 1.5 Sintering&Spray
TIOx 4N - 4.23 1800 4 7.14 Sintering&Spray
 

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Gold Member Since 2023

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Manufacturer/Factory
Main Products
Sputtering Target
Number of Employees
6