99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target

Product Details
Application: Industrial
Formula: Aluminum
Classification: Metal Traget
Gold Member Since 2023

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  • 99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target
  • 99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target
  • 99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target
  • 99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target
  • 99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target
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Basic Info.

Model NO.
CYT-Al
Grade Standard
Industrial Grade
Certification
ISO
Shape
Rotary,Flat,Round
Transport Package
Wooden Box
Specification
Customized Size
Trademark
CANYUAN
Origin
China
Production Capacity
1000PCS

Product Description


 
99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target
Aluminum is a silver-white metal which are very light and has good ductility, electrical conductivity, thermal conductivity, heat resistance and radiation resistance. There is always a oxidized aluminum on the surface of aluminum, because aluminum is very easy to get oxidation in the air which give aluminum good corrosion resistance.
Because aluminum has good performance and abundant in quantity, it is often made into rods, sheets, foils, powders, ribbons and filaments which is widely used in important industrial fields such as aviation, construction, automobiles, and electric power.
Aluminum targets are mainly used in the thin film solar industry, low-e glass industry, flat panel display industry, optical coating industry, tool and decorative coating industry, and high-purity aluminum targets are mostly used in chip manufacturing and advanced packaging.
We can make flat Ni targets and rotary sputtering targets.
The description composition analysis table of 4N5 high-purity Nickel target as below:
 Targets Specification
Application PVD sputtering materials
Material Aluminum
Purity 4N5
Size customized
Thickness customized
Shape Rotary sputtering Target, Ring type, sheet type, Plat type and Tube type
Density 2.7g/cm3
Melting Point 660ºC
Produce method HIP

 99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target

Our Advantage
99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target
99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target


Operation Process
99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target
99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target

Packing Picture
99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target
99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target
99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target


Application:
99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target
99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target
99.999% High Purity Al Aluminum Sputtering Target Plate /Al Aluminum Metal Target

Relating Product
Material Purity
(N)
Components
(wt%)
Density Melting
 Point
Thermal
Conductivity
(Wm-1K-1)
Coefficient of
 expansion
(10-6k-1)
Production
 Process
Al 3N - 2.7 660 235 23.1 Smelting
Cr 3N5 - 7.22 1907 94 4.9 HIP,Smelting
Cu 4N - 8.9 1084 400 16.5 Smelting
Ni 3N5 - 4.5 1453 90 13 Smelting
Ti 3N - 4.5 1668 15.2 9.4 Smelting
Zr 3N - 6.49 1852 0.227 - Smelting
Si 4N - 2.33 1414 150 2.6 Sintering&Spray
Ag 4N - 10.49 961.93 429 19 Smelting
C 4N - 2.23 3850±50 151 - HIP
TiAl 3N5 AS REQUESTED - - - - Smelting
InSn 4N AS REQUESTED - - - - Casting
CrSi 4N AS REQUESTED - - - - Spray
CrW 4N AS REQUESTED 16.7 3017 57 6.3 HIP
NiCr 3N AS REQUESTED - - - - Smelting
WC 3N AS REQUESTED 15.77 2870 110 5.5 Sintering&Spray
NbOx 4N AS REQUESTED 4.6 1460 5 1.5 Sintering&Spray

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