4n TiO2 Target Titanium Oxide Planner Sputtering Targets

Product Details
Application: Industrial
Formula: Titanium Oxide
Classification: Ceramic Traget
Gold Member Since 2023

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  • 4n TiO2 Target Titanium Oxide Planner Sputtering Targets
  • 4n TiO2 Target Titanium Oxide Planner Sputtering Targets
  • 4n TiO2 Target Titanium Oxide Planner Sputtering Targets
  • 4n TiO2 Target Titanium Oxide Planner Sputtering Targets
  • 4n TiO2 Target Titanium Oxide Planner Sputtering Targets
  • 4n TiO2 Target Titanium Oxide Planner Sputtering Targets
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Basic Info.

Model NO.
CYT-TIO2
Grade Standard
Industrial Grade
Certification
ISO
Shape
Rotary,Flat,Round
Transport Package
Wooden Box
Specification
Customized Size
Trademark
CANYUAN
Origin
China
Production Capacity
1000PCS

Product Description

4n TiO2 Target Titanium Oxide Planner Sputtering Targets
PRODUCT DESCRIPTION

The titanium oxide rotating target is produced by plasma spraying process, and the size and purity can be customized according to customer requirements.

The titanium oxide planar target is produced by hot press sintering process, generally bound to copper backplate for use, and the size and purity can also be customized according to customer requirements.

TECHNICAL PARAMETER

Purity: 99.99%; resistivity (20°C): ≤0.3Ω.cm.

Application areas: optical glass coating, LOW-E coated glass, thin-film solar coating, flat panel display coating, decorative coating.

We can make flat TIO2 and rotary sputtering targets.
Specification and purity can be customized.
The description and composition analysis table of 4N
TIO2
 as below:
 Targets Specification
Application PVD sputtering materials
Material TIO2 (titanium oxide)
Purity 4N
Size customized
Thickness customized
Shape Rotary sputtering Target, Ring type, sheet type, Plat type and Tube type
Density -g/cm3
Melting Point -ºC
Produce method HIP

4n TiO2 Target Titanium Oxide Planner Sputtering Targets
Our Advantage
4n TiO2 Target Titanium Oxide Planner Sputtering Targets
4n TiO2 Target Titanium Oxide Planner Sputtering Targets


Operation Process
4n TiO2 Target Titanium Oxide Planner Sputtering Targets
4n TiO2 Target Titanium Oxide Planner Sputtering Targets

Packing Picture
4n TiO2 Target Titanium Oxide Planner Sputtering Targets
4n TiO2 Target Titanium Oxide Planner Sputtering Targets
4n TiO2 Target Titanium Oxide Planner Sputtering Targets


Application:
4n TiO2 Target Titanium Oxide Planner Sputtering Targets
4n TiO2 Target Titanium Oxide Planner Sputtering Targets
4n TiO2 Target Titanium Oxide Planner Sputtering Targets

Relating Product
Material Purity
(N)
Components
(wt%)
Density Melting
 Point
Thermal
Conductivity
(Wm-1K-1)
Coefficient of
 expansion
(10-6k-1)
Production
 Process
Al-Alloy 5N - 2.7 660 235 23.1 Smelting
Cr 3N5 - 7.22 1907 94 4.9 HIP
Cu 4N - 8.9 1084 400 16.5 Smelting
Mo-alloy 3N5 - 10.28 2623 139 4.8 HIP
Nb 4N - 8.6 2477 54 7.3 Smelting
Ta 4N - 16.7 3017 57 6.3 Smelting
Si 4N - 2.33 1414 150 2.6 Sintering&Spray
TI 5N - 4.5 1670 22 8.6 Smelting
W 4N - 19.25 3422 174 4.5 HIP
AZO 3N5 98:2 5.6 1975 22 1.5 Sintering
ITO 4N 90:10 7.15 2000 15 2.0 Sintering
GZO 3N5 AS REQUESTED 7.15 - - - Sintering
IGZO 4N AS REQUESTED - - - - Sintering
NbOx 4N - 4.6 1460 5 1.5 Sintering&Spray
TIOx 4N - 4.23 1800 4 7.14 Sintering&Spray
 

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