4n High Purity Au Gold Sputtering Target Plate /Au Metal Target

Product Details
Application: Industrial
Formula: Gold
Classification: Metal Traget
Gold Member Since 2023

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  • 4n High Purity Au Gold Sputtering Target Plate /Au Metal Target
  • 4n High Purity Au Gold Sputtering Target Plate /Au Metal Target
  • 4n High Purity Au Gold Sputtering Target Plate /Au Metal Target
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Basic Info.

Model NO.
CYT-AU
Grade Standard
Industrial Grade
Certification
ISO
Shape
Rotary,Flat,Round
Transport Package
Wooden Box
Specification
Customized Size
Trademark
CANYUAN
Origin
China
Production Capacity
1000PCS

Product Description


 
4n High Purity Au Gold Sputtering Target Plate /Au Metal TargetGold is one of the monetary metals. Gold is solid at room temperature, has high density which is soft, bright and corrosion-resistant. It is the most malleable metal. Its ductility is second only to platinum and is one of the most malleable metals. Gold is widely used in the electronic industry, chemical industry, aerospace industry and traditional industries.

Gold sputtering targets are used in standard scanning electron microscope (SEM) coatings, and are also used to cover samples with a thin layer of conductive material. It can also be used for magnetron sputtering of semiconductors, displays, LEDs and photovoltaic devices, etc.
We can make flat Ni targets and rotary sputtering targets.
Specification and purity can be customized.
We can also make gold alloy targets, just as gold germanium targets and gold-tin alloy.
The description and composition analysis table of 4N high-purity gold target as below:
 
 Targets Specification
Application PVD sputtering materials
Material Gold
Purity 4N
Size customized
Thickness customized
Shape Rotary sputtering Target, Ring type, sheet type, Plat type and Tube type
Density 10.5g/cm3
Melting Point 1064ºC
Produce method HIP

4n High Purity Au Gold Sputtering Target Plate /Au Metal Target

Our Advantage
4n High Purity Au Gold Sputtering Target Plate /Au Metal Target
4n High Purity Au Gold Sputtering Target Plate /Au Metal Target


Operation Process
4n High Purity Au Gold Sputtering Target Plate /Au Metal Target
4n High Purity Au Gold Sputtering Target Plate /Au Metal Target

Packing Picture
4n High Purity Au Gold Sputtering Target Plate /Au Metal Target
4n High Purity Au Gold Sputtering Target Plate /Au Metal Target
4n High Purity Au Gold Sputtering Target Plate /Au Metal Target


Application:
4n High Purity Au Gold Sputtering Target Plate /Au Metal Target
4n High Purity Au Gold Sputtering Target Plate /Au Metal Target
4n High Purity Au Gold Sputtering Target Plate /Au Metal Target

Relating Product
Material Purity
(N)
Components
(wt%)
Density Melting
 Point
Thermal
Conductivity
(Wm-1K-1)
Coefficient of
 expansion
(10-6k-1)
Production
 Process
Al-Alloy 5N - 2.7 660 235 23.1 Smelting
Cr 3N5 - 7.22 1907 94 4.9 HIP
Cu 4N - 8.9 1084 400 16.5 Smelting
Mo-alloy 3N5 - 10.28 2623 139 4.8 HIP
Nb 4N - 8.6 2477 54 7.3 Smelting
Ta 4N - 16.7 3017 57 6.3 Smelting
Si 4N - 2.33 1414 150 2.6 Sintering&Spray
TI 5N - 4.5 1670 22 8.6 Smelting
W 4N - 19.25 3422 174 4.5 HIP
AZO 3N5 98:2 5.6 1975 22 1.5 Sintering
ITO 4N 90:10 7.15 2000 15 2.0 Sintering
GZO 3N5 AS REQUESTED 7.15 - - - Sintering
IGZO 4N AS REQUESTED - - - - Sintering
NbOx 4N - 4.6 1460 5 1.5 Sintering&Spray
TIOx 4N - 4.23 1800 4 7.14 Sintering&Spray

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