3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets

Product Details
Application: Industrial
Formula: Nickel-Vanadium
Classification: Alloy Traget
Gold Member Since 2023

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  • 3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets
  • 3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets
  • 3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets
  • 3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets
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Basic Info.

Model NO.
CYT-NiV
Grade Standard
Industrial Grade
Certification
ISO
Shape
Rotary,Flat,Round
Transport Package
Wooden Box
Specification
Customized Size
Trademark
CANYUAN
Origin
China
Production Capacity
1000PCS

Product Description

3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets
PRODUCT DESCRIPTION

The nickel-vanadium rotating target is obtained by repeatedly vacuum melting or vacuum smelting high-purity nickel-vanadium ingots, and then fabricated through forging, rolling, machining, etc. The size is customized according to customer requirements.

The nickel-vanadium plane target is obtained by repeatedly vacuum melting or vacuum smelting high-purity nickel-vanadium ingots, which are then subjected to hot isostatic pressing, followed by forging, annealing, rolling, machining, and other processes.

The resulting blank has uniform internal structure, fine grain size, and no internal defects, which meets the requirements of semiconductor nickel vanadium target blanks. The size is customized according to customer requirements.

Technical parameters

Purity: 99.95%; common ratio: 93-7V wt%.

Application fields: electronics and information, integrated circuits, displays and other industries.
We can make flat nickel-vanadium and rotary sputtering targets.
Specification and purity can be customized.
The description and composition analysis table of 3N high-purity 
nickel-vanadium as below:
 Targets Specification
Application PVD sputtering materials
Material nickel-vanadium
Purity 3N
Size customized
Thickness customized
Shape Rotary sputtering Target, Ring type, sheet type, Plat type and Tube type
Density -g/cm3
Melting Point -ºC
Produce method HIP

3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets
Our Advantage
3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets
3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets


Operation Process
3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets
3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets

Packing Picture
3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets
3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets
3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets


Application:
3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets
3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets
3n High Purity Nickel-Vanadium Sputtering Target Flat Plate / Rotating Targets

Relating Product
Material Purity
(N)
Components
(wt%)
Density Melting
 Point
Thermal
Conductivity
(Wm-1K-1)
Coefficient of
 expansion
(10-6k-1)
Production
 Process
Al-Alloy 5N - 2.7 660 235 23.1 Smelting
Cr 3N5 - 7.22 1907 94 4.9 HIP
Cu 4N - 8.9 1084 400 16.5 Smelting
Mo-alloy 3N5 - 10.28 2623 139 4.8 HIP
Nb 4N - 8.6 2477 54 7.3 Smelting
Ta 4N - 16.7 3017 57 6.3 Smelting
Si 4N - 2.33 1414 150 2.6 Sintering&Spray
TI 5N - 4.5 1670 22 8.6 Smelting
W 4N - 19.25 3422 174 4.5 HIP
AZO 3N5 98:2 5.6 1975 22 1.5 Sintering
ITO 4N 90:10 7.15 2000 15 2.0 Sintering
GZO 3N5 AS REQUESTED 7.15 - - - Sintering
IGZO 4N AS REQUESTED - - - - Sintering
NbOx 4N - 4.6 1460 5 1.5 Sintering&Spray
TIOx 4N - 4.23 1800 4 7.14 Sintering&Spray
 

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