6n High Purity Cu Copper Sputtering Target Flat Plate

Product Details
Application: Industrial
Formula: Aluminum
Classification: Metal Traget
Gold Member Since 2023

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  • 6n High Purity Cu Copper Sputtering Target Flat Plate
  • 6n High Purity Cu Copper Sputtering Target Flat Plate
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Basic Info.

Model NO.
CYT-CU
Grade Standard
Industrial Grade
Certification
ISO
Shape
Rotary,Flat,Round
Transport Package
Wooden Box
Specification
Customized Size
Trademark
CANYUAN
Origin
China
Production Capacity
1000PCS

Product Description


 
6n High Purity Cu Copper Sputtering Target Flat PlateCopper is a purple-red shiny metal with slightly hard, extremely tough, wear-resistant characteristic which has good ductility, good thermal conductivity, and electrical conductivity performance and corrosion resistance. Copper is very abundant in nature and easy to process which has excellent properties. So it is widely used in electrical, machinery manufacturing, construction industry, transportation and other fields.
We can produce copper from 3N to 6N high-purity targets after a series of processing with specific size and shape.
The oxygen content of our target can be less than 1ppm.
Since ultra-high purity copper has many excellent properties, it has been widely used in electronics, communications, superconductivity, aerospace, etc.
We can make flat copper targets and rotary sputtering targets.
This targets can be used as target backing plates .
Specification and purity can be customized.
The description and composition analysis table of 6N high-purity copper target as below:

  
 Targets Specification
Application PVD sputtering materials
Material Copper
Purity 6N
Size customized
Thickness customized
Shape Rotary sputtering Target, Ring type, sheet type, Plat type and Tube type
Density 8.96g/cm3
Melting Point 1083.4±0.2ºC
Produce method HIP

6n High Purity Cu Copper Sputtering Target Flat Plate

Our Advantage
6n High Purity Cu Copper Sputtering Target Flat Plate
6n High Purity Cu Copper Sputtering Target Flat Plate


Operation Process
6n High Purity Cu Copper Sputtering Target Flat Plate
6n High Purity Cu Copper Sputtering Target Flat Plate

Packing Picture
6n High Purity Cu Copper Sputtering Target Flat Plate
6n High Purity Cu Copper Sputtering Target Flat Plate
6n High Purity Cu Copper Sputtering Target Flat Plate


Application:
6n High Purity Cu Copper Sputtering Target Flat Plate
6n High Purity Cu Copper Sputtering Target Flat Plate
6n High Purity Cu Copper Sputtering Target Flat Plate

Relating Product
Material Purity
(N)
Components
(wt%)
Density Melting
 Point
Thermal
Conductivity
(Wm-1K-1)
Coefficient of
 expansion
(10-6k-1)
Production
 Process
Al 3N - 2.7 660 235 23.1 Smelting
Cr 3N5 - 7.22 1907 94 4.9 HIP,Smelting
Cu 4N - 8.9 1084 400 16.5 Smelting
Ni 3N5 - 4.5 1453 90 13 Smelting
Ti 3N - 4.5 1668 15.2 9.4 Smelting
Zr 3N - 6.49 1852 0.227 - Smelting
Si 4N - 2.33 1414 150 2.6 Sintering&Spray
Ag 4N - 10.49 961.93 429 19 Smelting
C 4N - 2.23 3850±50 151 - HIP
TiAl 3N5 AS REQUESTED - - - - Smelting
InSn 4N AS REQUESTED - - - - Casting
CrSi 4N AS REQUESTED - - - - Spray
CrW 4N AS REQUESTED 16.7 3017 57 6.3 HIP
NiCr 3N AS REQUESTED - - - - Smelting
WC 3N AS REQUESTED 15.77 2870 110 5.5 Sintering&Spray
NbOx 4N AS REQUESTED 4.6 1460 5 1.5 Sintering&Spray

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