3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target

Product Details
Application: Industrial
Formula: Tungsten
Classification: Metal Traget
Gold Member Since 2023

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  • 3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target
  • 3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target
  • 3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target
  • 3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target
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Basic Info.

Grade Standard
Industrial Grade
Certification
ISO
Shape
Rotary,Flat,Round
Transport Package
Wooden Box
Specification
Customized Size
Trademark
CANYUAN
Origin
China
Production Capacity
1000PCS

Product Description


 
3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal TargetTungsten is a silver-white metal that looks like steel. It has the highest melting point among all metal elements and has a slow evaporation rate. The chemical properties of tungsten are very stable. Tungsten is widely used in alloys, electronics, chemical industry and other fields due to its high melting point, high hardness, high density, good electrical and thermal conductivity, and small expansion coefficient.
Powder metallurgy is generally used to prepare tungsten targets, which are widely used in flat-panel displays, solar cells, integrated circuits, automotive glass, microelectronics, memory, X-ray tubes, medical equipment, smelting equipment and other products.
We can make flat copper targets and rotary sputtering targets.
Specification and purity can be customized. The description and composition analysis table of 3N5 high-purity copper target as below:
 Targets Specification
Application PVD sputtering materials
Material Tungsten
Purity 3N5
Size customized
Thickness customized
Shape Rotary sputtering Target, Ring type, sheet type, Plat type and Tube type
Density 13.35g/cm3
Melting Point 3422ºC
Produce method HIP

3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target

Our Advantage
3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target
3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target


Operation Process
3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target
3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target

Packing Picture
3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target
3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target
3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target


Application:
3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target
3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target
3n5 High Purity W Tungsten Sputtering Target Plate /W Tungsten Metal Target

Relating Product
Material Purity
(N)
Components
(wt%)
Density Melting
 Point
Thermal
Conductivity
(Wm-1K-1)
Coefficient of
 expansion
(10-6k-1)
Production
 Process
Al-Alloy 5N - 2.7 660 235 23.1 Smelting
Cr 3N5 - 7.22 1907 94 4.9 HIP
Cu 4N - 8.9 1084 400 16.5 Smelting
Mo-alloy 3N5 - 10.28 2623 139 4.8 HIP
Nb 4N - 8.6 2477 54 7.3 Smelting
Ta 4N - 16.7 3017 57 6.3 Smelting
Si 4N - 2.33 1414 150 2.6 Sintering&Spray
TI 5N - 4.5 1670 22 8.6 Smelting
W 4N - 19.25 3422 174 4.5 HIP
AZO 3N5 98:2 5.6 1975 22 1.5 Sintering
ITO 4N 90:10 7.15 2000 15 2.0 Sintering
GZO 3N5 AS REQUESTED 7.15 - - - Sintering
IGZO 4N AS REQUESTED - - - - Sintering
NbOx 4N - 4.6 1460 5 1.5 Sintering&Spray
TIOx 4N - 4.23 1800 4 7.14 Sintering&Spray

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