3n High Purity Silicon-Aluminum Sputtering Target Round Plate

Product Details
Application: Industrial
Formula: Silicon-Aluminum
Classification: Alloy Traget
Gold Member Since 2023

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  • 3n High Purity Silicon-Aluminum Sputtering Target Round Plate
  • 3n High Purity Silicon-Aluminum Sputtering Target Round Plate
  • 3n High Purity Silicon-Aluminum Sputtering Target Round Plate
  • 3n High Purity Silicon-Aluminum Sputtering Target Round Plate
  • 3n High Purity Silicon-Aluminum Sputtering Target Round Plate
  • 3n High Purity Silicon-Aluminum Sputtering Target Round Plate
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Basic Info.

Model NO.
CYT-SiAl
Grade Standard
Industrial Grade
Certification
ISO
Shape
Rotary,Flat,Round
Transport Package
Wooden Box
Specification
Customized Size
Trademark
CANYUAN
Origin
China
Production Capacity
1000PCS

Product Description

3n High Purity Silicon-Aluminum Sputtering Target Round Plate
PRODUCT DESCRIPTION

The silicon-aluminum rotating target is produced using spraying or hot isostatic pressing processes, and can produce a maximum length of 4000mm, with thickness and proportions customized according to customer requirements.

The silicon-aluminum planar target is produced using a vacuum magnetic levitation melting process, cast into ingots, and then subjected to thermal and mechanical processing and precision machining. The dimensions and proportions are customized according to customer requirements.

Technical parameters

Purity: 99.9-99.99%; common ratio: 90-10AI wt%, 70-30Al wt% etc.

Application areas: large-area glass coating industry, Low-E low-radiation glass, scratch-resistant and anti-glare glass, flat panel display glass, optics, optical communication, optical storage, and other industries.
We can make flat silicon-aluminum and rotary sputtering targets.
Specification and purity can be customized.
The description and composition analysis table of 3N high-purity 
silicon-aluminum as below:
 Targets Specification
Application PVD sputtering materials
Material silicon-aluminum
Purity 3N~5N
Size customized
Thickness customized
Shape Rotary sputtering Target, Ring type, sheet type, Plat type and Tube type
Density -g/cm3
Melting Point -ºC
Produce method melting and mixing

3n High Purity Silicon-Aluminum Sputtering Target Round Plate
Our Advantage
3n High Purity Silicon-Aluminum Sputtering Target Round Plate
3n High Purity Silicon-Aluminum Sputtering Target Round Plate


Operation Process
3n High Purity Silicon-Aluminum Sputtering Target Round Plate
3n High Purity Silicon-Aluminum Sputtering Target Round Plate

Packing Picture
3n High Purity Silicon-Aluminum Sputtering Target Round Plate
3n High Purity Silicon-Aluminum Sputtering Target Round Plate
3n High Purity Silicon-Aluminum Sputtering Target Round Plate


Application:
3n High Purity Silicon-Aluminum Sputtering Target Round Plate
3n High Purity Silicon-Aluminum Sputtering Target Round Plate
3n High Purity Silicon-Aluminum Sputtering Target Round Plate

Relating Product
Material Purity
(N)
Components
(wt%)
Density Melting
 Point
Thermal
Conductivity
(Wm-1K-1)
Coefficient of
 expansion
(10-6k-1)
Production
 Process
Al-Alloy 5N - 2.7 660 235 23.1 Smelting
Cr 3N5 - 7.22 1907 94 4.9 HIP
Cu 4N - 8.9 1084 400 16.5 Smelting
Mo-alloy 3N5 - 10.28 2623 139 4.8 HIP
Nb 4N - 8.6 2477 54 7.3 Smelting
Ta 4N - 16.7 3017 57 6.3 Smelting
Si 4N - 2.33 1414 150 2.6 Sintering&Spray
TI 5N - 4.5 1670 22 8.6 Smelting
W 4N - 19.25 3422 174 4.5 HIP
AZO 3N5 98:2 5.6 1975 22 1.5 Sintering
ITO 4N 90:10 7.15 2000 15 2.0 Sintering
GZO 3N5 AS REQUESTED 7.15 - - - Sintering
IGZO 4N AS REQUESTED - - - - Sintering
NbOx 4N - 4.6 1460 5 1.5 Sintering&Spray
TIOx 4N - 4.23 1800 4 7.14 Sintering&Spray
 

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