99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target

Product Details
Application: Industrial
Formula: Tantalum
Classification: Metal Traget
Gold Member Since 2023

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  • 99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target
  • 99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target
  • 99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target
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Basic Info.

Model NO.
CYT-TA
Grade Standard
Industrial Grade
Certification
ISO
Shape
Rotary,Flat,Round
Transport Package
Wooden Box
Specification
Customized Size
Trademark
CANYUAN
Origin
China
Production Capacity
1000PCS

Product Description


 
99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target
Pure tantalum has a slightly blue color and excellent ductility. It can be rolled into very thin (less than 0.01 mm) plates without intermediate annealing in the cold state. The corrosion resistance of tantalum is the same as that of glass. Metal tantalum is stable in air at room temperature. When heated to above 500°C, oxidation and become form Ta205. Tantalum has a series of excellent properties such as high melting point, low vapor pressure, good cold working performance, high chemical stability, strong resistance to liquid metal corrosion, and large dielectric constant of surface oxide film. It is widely used in electronics, metallurgy, steel, chemical industry, cemented carbide, It has important applications in high-tech fields such as atomic energy, superconducting technology, automotive electronics, aerospace, medical and health care, and scientific research.
Tantalum targets are mainly used in semiconductor coatings and optical coatings.
Tantalum targets can be made in planar and rotating types, specifications and purity can be customized. The picture below is the composition analysis table of 3N5 high-purity tantalum target:

 
  Targets Specification
Application PVD sputtering materials
Material Tantalum
Purity 3N5
Size customized
Thickness customized
Shape Rotary Chromium sputtering Target, Ring type, sheet type, Plat type and Tube type
Density 16.68g/cm3
Melting Point 2980ºC
Produce method HIP


Our Advantage
99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target
99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target


Operation Process
99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target
99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target

Packing Picture
99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target
99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target
99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target


Application:
99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target
99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target
99.999% High Purity Tantalum Ta Sputtering Target Plate /Tantalum Ta Metal Target

Relating Product
Material Purity
(N)
Components
(wt%)
Density Melting
 Point
Thermal
Conductivity
(Wm-1K-1)
Coefficient of
 expansion
(10-6k-1)
Production
 Process
Al-Alloy 5N - 2.7 660 235 23.1 Smelting
Cr 3N5 - 7.22 1907 94 4.9 HIP
Cu 4N - 8.9 1084 400 16.5 Smelting
Mo-alloy 3N5 - 10.28 2623 139 4.8 HIP
Nb 4N - 8.6 2477 54 7.3 Smelting
Ta 4N - 16.7 3017 57 6.3 Smelting
Si 4N - 2.33 1414 150 2.6 Sintering&Spray
TI 5N - 4.5 1670 22 8.6 Smelting
W 4N - 19.25 3422 174 4.5 HIP
AZO 3N5 98:2 5.6 1975 22 1.5 Sintering
ITO 4N 90:10 7.15 2000 15 2.0 Sintering
GZO 3N5 AS REQUESTED 7.15 - - - Sintering
IGZO 4N AS REQUESTED - - - - Sintering
NbOx 4N - 4.6 1460 5 1.5 Sintering&Spray
TIOx 4N - 4.23 1800 4 7.14 Sintering&Spray

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