High Purity Silicon-Aluminum Sputtering Target

• Application: Industrial
• Formula: Silicon-Aluminum
• Classification: Alloy Traget
• Model NO.: CYT-SiAl
• Grade Standard: Industrial Grade
• Certification: ISO
• Shape: Rotary,Flat,Round
• Transport Package: Wooden Box
• Specification: Customized Size
• Trademark: CANYUAN
• Origin: China
• Production Capacity: 1000PCS

Product Description

PRODUCT DESCRIPTION

The silicon-aluminum rotating target is produced using spraying or hot isostatic pressing processes, and can produce a maximum length of 4000mm, with thickness and proportions customized according to customer requirements.

The silicon-aluminum planar target is produced using a vacuum magnetic levitation melting process, cast into ingots, and then subjected to thermal and mechanical processing and precision machining. The dimensions and proportions are customized according to customer requirements.

Technical parameters

Purity: 99.9-99.99%; common ratio: 90-10AI wt%, 70-30Al wt% etc.

Application areas: large-area glass coating industry, Low-E low-radiation glass, scratch-resistant and anti-glare glass, flat panel display glass, optics, optical communication, optical storage, and other industries.
We can make flat silicon-aluminum and rotary sputtering targets.
Specification and purity can be customized.
The description and composition analysis table of 3N high-purity silicon-aluminum as below:

Targets Specification
Application	PVD sputtering materials
Material	silicon-aluminum
Purity	3N~5N
Size	customized
Thickness	customized
Shape	Rotary sputtering Target, Ring type, sheet type, Plat type and Tube type
Density	-g/cm3
Melting Point	-ºC
Produce method	melting and mixing

Our Advantage

Operation Process

Packing Picture

Application:

Relating Product

Material	Purity (N)	Components (wt%)	Density	Melting  Point	Thermal Conductivity (Wm-1K-1)	Coefficient of  expansion (10-6k-1)	Production  Process
Al-Alloy	5N	-	2.7	660	235	23.1	Smelting
Cr	3N5	-	7.22	1907	94	4.9	HIP
Cu	4N	-	8.9	1084	400	16.5	Smelting
Mo-alloy	3N5	-	10.28	2623	139	4.8	HIP
Nb	4N	-	8.6	2477	54	7.3	Smelting
Ta	4N	-	16.7	3017	57	6.3	Smelting
Si	4N	-	2.33	1414	150	2.6	Sintering&Spray
TI	5N	-	4.5	1670	22	8.6	Smelting
W	4N	-	19.25	3422	174	4.5	HIP
AZO	3N5	98:2	5.6	1975	22	1.5	Sintering
ITO	4N	90:10	7.15	2000	15	2.0	Sintering
GZO	3N5	AS REQUESTED	7.15	-	-	-	Sintering
IGZO	4N	AS REQUESTED	-	-	-	-	Sintering
NbOx	4N	-	4.6	1460	5	1.5	Sintering&Spray
TIOx	4N	-	4.23	1800	4	7.14	Sintering&Spray