4n High Purity AG Silver Sputtering Target Plate /AG Silver Metal Target

• Application: Industrial
• Formula: Silver
• Classification: Metal Traget
• Model NO.: CYT-Ag
• Grade Standard: Industrial Grade
• Certification: ISO
• Shape: Rotary,Flat,Round
• Transport Package: Wooden Box
• Specification: Customized Size
• Trademark: CANYUAN
• Origin: China
• Production Capacity: 1000PCS

Product Description

 

The physical and chemical properties of silver are stable, with good thermal and electrical conductivity, softness, ductility, and high reflectivity. It is widely used in many fields such as electronic and electrical materials, photosensitive materials, chemical and chemical materials, etc.
Elemental silver and silver alloys can be used as reflective films, electrode films, wiring films or translucent films (semi-permeable films) in the following industries: organic EL displays, lighting, touch screens, thin film solar cells, LED (light emitting diodes)), Low- E glass (building materials), optical recording media (BD, DVD, CD, etc.). Although the silver film has good properties such as low resistance and high reflectivity, the reflectivity and conductivity will decrease due to corrosion. So we usually make add other metal to make silver alloy so as to have low resistance and high reflectivity.
We can make flat Ag targets and rotary sputtering targets. The description composition analysis table of 4N high-purity silver target as below:
 

Targets Specification
Application	PVD sputtering materials
Material	Silver
Purity	4N
Size	customized
Thickness	customized
Shape	Rotary sputtering Target, Ring type, sheet type, Plat type and Tube type
Density	10.5g/cm3
Melting Point	2163ºC
Produce method	HIP

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Operation Process

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Relating Product

Material	Purity (N)	Components (wt%)	Density	Melting  Point	Thermal Conductivity (Wm-1K-1)	Coefficient of  expansion (10-6k-1)	Production  Process
Al-Alloy	5N	-	2.7	660	235	23.1	Smelting
Cr	3N5	-	7.22	1907	94	4.9	HIP
Cu	4N	-	8.9	1084	400	16.5	Smelting
Mo-alloy	3N5	-	10.28	2623	139	4.8	HIP
Nb	4N	-	8.6	2477	54	7.3	Smelting
Ta	4N	-	16.7	3017	57	6.3	Smelting
Si	4N	-	2.33	1414	150	2.6	Sintering&Spray
TI	5N	-	4.5	1670	22	8.6	Smelting
W	4N	-	19.25	3422	174	4.5	HIP
AZO	3N5	98:2	5.6	1975	22	1.5	Sintering
ITO	4N	90:10	7.15	2000	15	2.0	Sintering
GZO	3N5	AS REQUESTED	7.15	-	-	-	Sintering
IGZO	4N	AS REQUESTED	-	-	-	-	Sintering
NbOx	4N	-	4.6	1460	5	1.5	Sintering&Spray
TIOx	4N	-	4.23	1800	4	7.14	Sintering&Spray