4n High Purity Sn Tin Sputtering Target Plate /Sn Tin Metal Target

• Application: Industrial
• Formula: Tin
• Classification: Metal Traget
• Grade Standard: Industrial Grade
• Certification: ISO
• Shape: Rotary,Flat,Round
• Model NO.: CYT-Sn
• Transport Package: Wooden Box
• Specification: Customized Size
• Trademark: CANYUAN
• Origin: China
• Production Capacity: 1000PCS

Product Description

 

Tin is a low melting point metal with a silvery white metallic luster. Pure tin is soft, has good malleability at room temperature which is not easily oxidized and very stable in chemicals. Tin is one of the most widely used metals in industry. It has excellent properties such as soft texture, low melting point, strong malleability, strong plasticity and non-toxicity. It is mainly used in the manufacture of solders, tin-plated sheets, alloys, chemical products, etc. It is widely used in electronics, information, electrical appliances, chemical industry, and metallurgy, building materials, machinery, food packaging, atomic energy and aerospace industries.
Due to its low melting point, tin sputtering targets generally use the casting process. Tin targets are mainly used for thin film deposition in fuel cells, decoration, semiconductors, displays, LED and photovoltaic equipment, glass coatings, etc. Tin is also used to coat other metals to prevent corrosion. Tin alloys are important in soft solders, tin, bronze and phosphor bronze.
For example, niobium-tin alloys are used in superconducting magnets.
We can make flat Sn targets and rotary sputtering targets.
And tin alloy targets such as tin-zinc, tin-aluminum, tin-indium, tin-silver, tin-copper alloy targets,
The description composition analysis table of 4N high-purity tin target as below:

 

Targets Specification
Application	PVD sputtering materials
Material	Tin
Purity	4N
Size	customized
Thickness	customized
Shape	Rotary sputtering Target, Ring type, sheet type, Plat type and Tube type
Density	7.28g/cm3
Melting Point	22600ºC
Produce method	casting

Our Advantage

Operation Process

Packing Picture

Application:

Relating Product

Material	Purity (N)	Components (wt%)	Density	Melting  Point	Thermal Conductivity (Wm-1K-1)	Coefficient of  expansion (10-6k-1)	Production  Process
Al-Alloy	5N	-	2.7	660	235	23.1	Smelting
Cr	3N5	-	7.22	1907	94	4.9	HIP
Cu	4N	-	8.9	1084	400	16.5	Smelting
Mo-alloy	3N5	-	10.28	2623	139	4.8	HIP
Nb	4N	-	8.6	2477	54	7.3	Smelting
Ta	4N	-	16.7	3017	57	6.3	Smelting
Si	4N	-	2.33	1414	150	2.6	Sintering&Spray
TI	5N	-	4.5	1670	22	8.6	Smelting
W	4N	-	19.25	3422	174	4.5	HIP
AZO	3N5	98:2	5.6	1975	22	1.5	Sintering
ITO	4N	90:10	7.15	2000	15	2.0	Sintering
GZO	3N5	AS REQUESTED	7.15	-	-	-	Sintering
IGZO	4N	AS REQUESTED	-	-	-	-	Sintering
NbOx	4N	-	4.6	1460	5	1.5	Sintering&Spray
TIOx	4N	-	4.23	1800	4	7.14	Sintering&Spray